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Peter Borgesen

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Beam-solid Interactions - Physical Phenomena
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Thin Films: Volume 308
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Electronic Packaging Materials Science VII
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Materials Reliability in Microelectronics IV
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Thin Films: Volume 356
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Electronic Packaging Materials Science VIII
Electronic Packaging Materials Science VIII: Volume 390 (MRS Proceedings)

By Peter Borgesen (Edited by), Kenneth A. Jackson (Edited by), Robert C. Sundahl (Edited by), King-Ning Tu (Edited by)

Hardback (USA), September 1995
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