Table of Contents

1. Introduction to Microelectronics and Nanoelectronics 2. Origin and Evolution of 3D Integration 3. Trends and Outlook of 3D IC Packaging 4. Through-Silicon Vias (TSVs) Technology 5. Challenges and Outlook of 3D Si Integration 6. Challenges and Outlook of 3D IC Integration 7. Thin-Wafer Strength Measurements 8. Thin-Wafer Handling 9. Low-Cost Microbumping 10. C2C and C2W Bonding with Microbumps 11. Low Temperature Bonding 12. Electromigration of Microbump Assemblies 13. Memory Stacking Methods 14. Active TSV Interposers 15. Passive TSV Interposers 16. Thermal Management of 3D IC Integration 17. 3D IC and CIS Integration 18. 3D IC and MEMS Integration 19. 3D IC and LED Integration 20. Embedded 3D Hybrid IC and Opto-electronic Integration in Organic Substrates

About the Author

John H. Lau, Ph.D., P.E., IEEE Fellow, ASME Fellow, ITRI Fellow, spent 30 years in the electronics industry (HP and Agilent) in Palo Alto, California, and currently serves as a fellow at the Electronics & Optoelectronics Laboratories, Industrial Technology Research Institute (ITRI), Taiwan. He has published 16 books with McGraw-Hill, including Reliability of RoHS-Compliant 2D and 3D IC Interconnects , Advanced MEMS Packaging, Electronics Manufacturing with Lead-Free Solders and Low Cost Flip Chip Technologies.