This edition continues to focus on educating the electronics engineer in surface mount principles, mainstream industry practices, and technology options. The chapters are a "walk-through" of the actual assembly process. A new chapter discusses the effect of high pin count devices (fine pitch, BGA, and PGA) and their impact on board assembly. Expanded coverage of water soluble paste, no clean paste, and lead free solder addresses the environmental issues current to the industry.

Table of Contents

Part One: Introduction to surface mounting. Introduction to surface mount technology. Implementing SMT in-house and at subcontractors. Part Two: Designing with surface mounting. Surface mount components. Substrates for surface mounting. Surface mount design considerations. Surface mount land pattern design. Design for manufacturability, testing, and repair. Part Three: Manufacturing with surface mounting. Adhesive and its application. Solder paste and its application. Metallurgy of soldering and solderability. Component placement. Soldering of surface mounted components. Flux and cleaning. Quality control, inspection repair, and testing. Appendix A. Appendix B. Appendix C. Glossary. Index.